DPC工艺
Direct Plating copper(DPC)
DPC is also known as direct copper plating substrate. First, the ceramic substrate is cleaned by pre-treatment, and the ceramic substrate is sputtered and bonded to the copper-metal composite layer using the professional thin film manufacturing technology-vacuum coating method. Development, etching, and film removal processes complete the circuit production, and finally increase the thickness of the circuit by electroplating/electroless plating. After the photoresist is removed, the metallized circuit is completed.
Direct plating copper technology is a ceramic circuit processing technology developed on the basis of ceramic film processing. Different from the traditional thick film and thin film processing technology, its processing further strengthens the electrochemical processing requirements. After the ceramic surface is metalized by physical methods, electrochemical processing of conductive copper and functional film layers is used.
Its advantages are concentrated in the following five areas:
Advantage Number | Characteristic | Distinguish the thick film process | Differentiating the thin film process |
Advantage One | Relatively fast processing speed | No need for printing screen and ceramic sintering test | No need for mask chrome plate processing |
Advantage two | There are no restrictions on the type and thickness of ceramics, covering any inorganic materials | High-purity single crystal growth of inorganic materials cannot be processed | Difficult to handle ceramic plates with a thickness of more than 1mm |
Advantage three | There are no restrictions on metal type and thickness | Some metals cannot be made into slurry< | The thickness of the metal film should not exceed 10 microns |
Advantage four | The crystallization of the metal is perfect | Sintered metal porosity | Sputtered metal crystals are thinner |
Advantage Five | Suitable for micron level fine processing | It is difficult to process circuits with an accuracy of 10 microns or less | It is difficult to process circuits with accuracy above 2 microns |