News

  • Advantages of DPC aluminum nitride ceramic substrate on LED headlights

    With the increasing maturity of ceramic circuit board materials and technology, our company produces high precision aluminum nitride ceramic PCB, 3D ceramic plate and dam fencing technology. By the...

    2022

    08-15

  • Packaging of aluminum nitride ceramic substrate for unmanned laser sensor.

    Domestically invested unmanned driving can realize intelligent voice, do not need to enter the address, can automatically locate to reach the place, see someone in front of the automatic pause; Yo...

    2022

    06-21

  • LED packaging PCB and DPC ceramic board difference

    Prosperous cities are inseparable from the decoration of LED lights. I believe we have all seen LED. Its figure has appeared in every place of our lives and illuminates our lives. As the carr...

    2022

    05-11

  • Ceramic PCB

    With the development and progress of science and technology in China, technology is constantly updated, and the stability of high power and performance. The demand for PCB is getting higher and hi...

    2022

    04-24

  • Advantages and characteristics of ceramic PCB board

    1. Why use ceramic circuit board Ordinary PCB is usually made of copper foil and substrate bonding, and the substrate material is mostly glass fiber (FR-4), phenolic resin (FR-3) and other materi...

    2022

    03-01

  • Ceramic circuit board in LED packaging field

    Ceramic substrate has good thermal and electrical properties, is an excellent material for power TYPE LED packaging, violet light, UV, especially suitable for multi-chip packaging (MCM) and substra...

    2022

    02-21

  • Application of DPC ceramic substrate in LED

    With the progress of science and technology, the demand for LED is getting higher and higher. Despite the continuous upgrading of LED technology in recent years, the efficiency of LED light is get...

    2022

    02-14

  • Introduction to ceramic substrate

    Ceramic substrate refers to the DPC process to bond copper to alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate surface (single or double) on the special process plate. The ultra-thin co...

    2021

    12-21