Characteristics of DPC ceramic substrate  

(1) Mechanical properties  

It has high enough mechanical strength to be used as a supporting component in addition to carrying components;  Good machinability, high dimensional accuracy;  Easy to achieve multi-layer;  

Smooth surface, no warping, bending, microcrack, etc.  

(2) Electrical properties  

High insulation resistance and insulation failure voltage;  

Low dielectric constant;  

Low dielectric loss;  

Stable performance under high temperature and high humidity to ensure reliability.  

(3) Thermal properties  

High thermal conductivity;  

The coefficient of thermal expansion should be matched with related materials (especially with Si);  

Excellent heat resistance.  

(4) Other properties  

Good chemical stability;  Easy to metallize, strong adhesion to circuit graphics;  

No hygroscopicity;  Oil and chemical resistance;  A ray emission is small;  

DPC ceramic substrate application:  

1. VCSEL packaging:  

VCSEL power density is very high, DPC ceramic circuit board with VCSEL high matching thermal expansion coefficient, so as to solve the chip and substrate thermal expansion mismatch caused by the stress problem.  The DPC ceramic circuit board makes the metal edge and ceramic substrate closely combined, avoiding the extra paste process, coordination accuracy and other problems in the later assembly process, as well as the reliability problems caused by glue aging.  The ceramic circuit board of DPC film technology can almost meet the packaging requirements of VCSEL.  

2. IGBT package:  

Insulated gate bipolar transistor has become the main development trend of power semiconductor devices due to its characteristics of high input impedance, fast switching speed, low on-state voltage and high blocking voltage.  Its application is as small as frequency conversion air conditioning, silent refrigerator, washing machine, induction cooker, microwave oven and other household appliances, as large as electric locomotive traction system.  Because IGBT has high output power and high calorific value, heat dissipation is the key for IGBT package.  At present, IGBT packaging mainly uses DPC ceramic substrate, the reason is that DPC ceramic substrate has a large metal layer thickness, high bonding strength (good thermal impact) and other characteristics.  

3. LED encapsulation:  

Throughout the development of LED technology, the power density is increasing, and the requirements for heat dissipation of the support are getting higher and higher.  DPC ceramic substrate has high insulation, high thermal conductivity and heat resistance, low expansion and other characteristics, especially the through hole interconnection technology, well meet LED flip, eutectic, COB(chip on board), CSP(chip scale package), WLP (wafer package) packaging requirements, suitable for medium and high power LED packaging.