DPC ceramic substrate with its excellent performance and gradually reduced price in many electronics  Packaging materials show strong competitiveness in high-power LED packaging substrates as heat and air  As a carrier of air convection, its thermal conductivity plays a decisive role in the heat dissipation of LED  Rate LED packaging development trend.  With the development of science and technology, new preparation technology  At present, the high thermal conductivity ceramic material as a new electronic packaging substrate material, the application prospect is very broad.  In LED heat dissipation channel, packaging substrate is the key link to connect the internal and external heat dissipation channel, and  The function of heat dissipation channel circuit connection and physical support for the chip.  As the LED core  

The continuous improvement of chip input power, large dissipation power brings large heat to LED packaging materials  Material has put forward the newer, higher request.  For high power LED products, the packaging substrate  It is required to have high electrical insulation, high thermal conductivity, matching chip thermal expansion coefficient and other characteristics.  Resin based packaging substrate: the high cost of supporting the popularity of the difficulty, EMC and SMC  Molding equipment requirements are high, large-scale popularization is still difficult.  

         In recent years, the rise of SMT LED bracket generally adopts high temperature modified engineering plastic materials, PPA(polyphthalamide) resin as raw material PPA plastic thermal conductivity is very low, its heat dissipation mainly through the metal lead frame, heat dissipation capacity is limited, only suitable for low-power LED packaging.                                                                                                                                With the development of LED packaging to thin and low cost, chip on board (COB)  Packaging technology is gradually emerging.  At present, most COB package substrates use metal core printed circuits  Board, high power LED packaging mostly use this substrate, its price between the middle and high.  The current production of general high-power LED heat dissipation substrate, its insulation layer thermal conductivity is very low,  And because of the existence of insulation layer, it can not withstand high temperature welding, which limits the packaging structure  Is not conducive to LED heat dissipation.  

       In recent years, silicon based materials as LED packaging substrate technology, gradually from the semiconductor industry  Introduced to the LED industry.  The thermal conductivity and thermal expansion properties of silicon substrate indicate that silicon is connected with  LED matching packaging materials.  Silicon has a thermal conductivity of 140W/mK and is used in leds  When packaged, the resulting thermal resistance is only 066K/W: and silicon-based materials are widely used  In the field of semiconductor process and related packaging, the related equipment and materials are quite mature.  Therefore, if silicon is made into LED packaging substrate, it is easy to form mass production.  However, there are still many technical problems with LED silicon substrate packaging.  For example, materials, silicon  Easy to crack, and the strength of the mechanism is also problematic.  Structurally, silicon is an excellent heat conductor,  But the insulation is poor, must do oxidation insulation treatment.  In addition, the metal layer shall be spattered  The conductive holes should be prepared by means of electroplating.  In general, insulation  The preparation of layer, metal layer and through-hole is facing challenges, and the yield is not high.  There are some at the moment  Taiwan enterprises developed LED silicon substrate and mass production, but the rate of good is less than 60%.  

              Ceramic packaging substrate: improve the heat dissipation efficiency, meet the needs of high power LED, with high thermal conductivity of the ceramic substrate, DPC significantly improve the heat dissipation efficiency, is the most suitable for the development of high power, small size LED products.  The ceramic heat dissipation substrate has a new thermal conductivity material and a new internal structure, which makes up for the defects of aluminum metal substrate, so as to improve the overall heat dissipation effect of the substrate.  Among the ceramic materials that can be used as heat dissipation substrate, BeO has high thermal conductivity, but its linear expansion coefficient is very different from silicon (Si), and it is toxic when manufacturing, which limits its application.  BN has good comprehensive performance, but as a substrate material, there are no outstanding advantages, and the price is expensive, currently only in the research and promotion;  Silicon carbide (SiC) has high strength and high thermal conductivity, but its resistance and insulation value is low, bonding instability after metallization, will cause changes in thermal conductivity and dielectric constant, should not be used as insulating packaging substrate material.  Al203 ceramic substrate is the most widely used ceramic substrate, but due to its higher thermal expansion coefficient than Si single crystal, AI203 ceramic substrate is not suitable for high frequency, high power, very large scale integrated circuits.  A1N crystals have high thermal conductivity and are considered as ideal materials for next-generation semiconductor substrates and packaging.  AIN ceramic materials have been widely studied and gradually developed since the 1990s. It is widely considered as a promising electronic ceramic packaging material at present.  The heat dissipation efficiency of AIN ceramic substrate is 7 times that of AI203 substrate, and the heat dissipation efficiency of AIN ceramic substrate using dry high power LED is significant, thus greatly improving the service life of LED.  The disadvantage of AIN substrate is that even if there is a very thin oxide layer on the surface, it will have a great influence on the thermal conductivity. Only by strictly controlling the material and process, can a good consistency of AIN substrate be produced.  Compared with the Al2O3 substrate widely used at present, the cost of AIN substrate is about 3 to 5 times that of A1203.  Now that the energy has been generated, the cost of AIN substrate can be rapidly reduced, and the AIN substrate with strong heat dissipation efficiency will replace A12O3 substrate.  

           DPC ceramic substrate is also known as direct copper plating ceramic plate. DPC products have the characteristics of high circuit accuracy and high surface flatness, and are very suitable for LED coating/eutectic process. With high thermal conductivity ceramic substrate, the heat dissipation efficiency is significantly improved, which is the most suitable ceramic heat dissipation substrate for high power and small size LED development.  Beijing Altai Technology Development Co., Ltd. is also actively doing the research and development of this work, in short, the use of DPC ceramic substrate packaging will be the future trend of power LED development.