With the progress of science and technology, the demand for LED is getting higher and higher.  Despite the continuous upgrading of LED technology in recent years, the efficiency of LED light is getting higher and higher. The efficiency of high-power LED chips can only reach 70 to 80 percent, which means that 20 to 30 percent of electricity is still converted into heat.  For the heat generated by LED, it must be conducted out.  At present, the main way is to transmit to the PCB board, but then it will be found that the heat conduction channel and the conductive channel on the back of the chip are overlapping, which is the key to choose what kind of material for the heat conduction channel.  

The existing solution is to fix the chip directly on the copper heat sink, but the copper heat sink itself is a conductive channel, in terms of light source level, there is no thermoelectric separation.  The light source is eventually packaged on a PCB board, which still requires an insulating layer to separate heat and electricity.  At this point, although the heat is not concentrated on the chip, it is concentrated near the insulation layer under the light source. Once more power is done, the heat problem will come out.  DPC ceramic substrate can solve this problem. It can directly fix the chip on the ceramic, make vertical interconnected holes in the ceramic, and form an independent internal conductive channel. The ceramic itself is both an insulator and can dissipate heat, so as to achieve thermoelectric separation at the light source level.  At this point, the PCB board does not need to consider the thermoelectric separation structure, there is no need to do an insulating layer on the PCB.  

Definition and characteristics of DPC ceramic substrate  

To solve the problem of thermoelectric separation in the light source level of the ceramic substrate should have the following characteristics: first of all, it must have high thermal conductivity, its thermal conductivity is dozens of times higher than resin;  The second is to have high insulation strength;  The third is the high line resolution, so as to carry out vertical connection with the chip or flip, there will be no problem;  The fourth is the high surface flatness, there will be no holes when welding;  Fifth, ceramics and metals should have high adhesion;  The sixth is the vertical interconnect conduction hole, so as to achieve the patch packaging, the circuit from the back to the front.  Only DPC ceramic substrate satisfies these conditions.  

DPC ceramic substrate is also called direct copper plating ceramic substrate. It adopts metallization of thin film and electroplating process technology. Metal circuit is made by image transfer method on ceramic substrate, and then perforated electroplating technology is used to form high-density double-sided wiring and vertical interconnection.  This is a product drawing of it, with the solid layer at the top, the welding layer at the bottom, and the ceramic in the middle, with vertical interconnect holes.  DPC ceramic substrate materials, alumina ceramics, its coefficient of thermal conductivity of 30 w, if you want to do more, we can use aluminum nitride, its coefficient of thermal conductivity is very high, up to 170W, the coefficient of thermal conductivity of aluminium alloy 220W to 230W, this means that it has about the same, and the metal thermal conductivity and the dielectric strength is very high,  This is a very good material.  So the higher the power, the better the performance of aluminum nitride ceramics.  

Application analysis of DPC ceramic substrate  

Traditional lighting: in high-power LED lighting, stage lights, street lights, landscape lighting has been widely used;  In the flash, CSP is also widely used, in addition, including now very hot car headlights, its LED light source is basically also using DPC ceramic substrate.  

Special lighting: such as UVC deep ULTRAVIOLET sterilization, UVA light fixation module.  LED infrared devices.  Laser guidance laser ranging, VCSEL, IGBT module, 5G communication and other industries.