Ceramic substrate has good thermal and electrical properties, is an excellent material for power TYPE LED packaging, violet light, UV, especially suitable for multi-chip packaging (MCM) and substrate direct bonding chip (COB) packaging structure.  

A, the comparison of ceramic material 1. Plastic and ceramic material is represented by epoxy resin plastic material has the characteristic economy, has a very wide range of applications in the electronic market, but along with the social progress in many special fields such as high temperature, expansion coefficient, air tightness and stability, the improvement of mechanical properties, etc, the plastic material can meet the new market requirements.  Ceramic materials for its high resistance, high frequency features is outstanding, and has high thermal conductivity, good chemical stability, thermal stability and other advantages, is widely used in different thick film, film, or and circuit substrate material, also can be used as an insulator, in thermal performance demanding circuit do heat conduction pathway and used to make all kinds of electronic components.  2. Comparison between aluminum nitride and alumina ceramic substrate, aluminum nitride ceramic substrate has two major advantages, one is high thermal conductivity, the other is the expansion coefficient matching with silicon.  The disadvantage is that the oxide layer will affect the thermal conductivity, the material and process requirements are higher.  Aluminum nitride currently costs more than alumina.  Alumina ceramic substrate is the most commonly used substrate material in the electronics industry, because in mechanical, thermal, electrical properties compared to most other oxide ceramics, high strength and chemical stability, and rich source of raw materials, suitable for a variety of technology manufacturing and different shapes.  

The types and characteristics of ceramic heat dissipation substrates on the market are mostly divided into HTCC, LTCC, DBC, DPC, and Yu Anxu Porcelain Electronic Technology Co., Ltd. has advanced DPC film technology.  1.HTCC and LTCCHTCC are relatively early developed technologies, but due to the high sintering temperature, the choice of electrode materials is limited, and the production cost is relatively high, these factors restrict the development of LTCC. Although LTCC reduces the co-firing temperature to about 850℃, it is difficult to control the size accuracy, product strength and other shortcomings.  2.DBC and DPC (DirectBondedCopper, DPC) technology is mainly based on al2o3.AlN ceramic substrate developed ceramic surface metallization technology,  In the high-power power semiconductor module, solar panel components, automotive electronics, aerospace and military electronic components, intelligent power components and other fields have been more successful applications.  

Thin film method (DPC) is the main method for metal film deposition in microelectronics manufacturing. It mainly uses evaporation, magnetron sputtering and other surface deposition processes to metallize the substrate surface, including titanium, then copper particles, and finally electroplating thickening. It is suitable for most ceramic substrates.  As a chip level manufacturing technology, integrated circuit (IC) etching manufacturing process has been able to easily complete the manufacture of high-precision micro-electronic and even nano-electronic devices.  

Advantages of DPC ceramic traditional substrate 1. Higher thermal conductivity Thermal conductivity represents a kind of ability of the substrate material itself to directly conduct heat, the higher the value represents the better its heat dissipation capacity.  The traditional metal substrate has good thermal conductivity, but the insulating layer is required due to the electrical conductivity of metal, and the thermal conductivity of the insulating layer is only 1.0W/m.K.  This greatly affects the overall thermal conductivity.  The ceramic substrate is insulated, without the use of an insulating layer, and the overall thermal conductivity is very high.  2. More matching thermal expansion coefficient When the lamp is normally turned on, the temperature is as high as 80℃~90℃, which will lead to unstable welding.  The general lamp is 0.1W, 0.3W, 0.5W, for 1W, 3W, 5W, lamp, PVC can not withstand.  The thermal expansion coefficient of ceramic and chip is close, so there will not be too much deformation in the temperature change, resulting in the line welding, internal stress and other problems.  3. Better bonding force The bonding strength of metal layer and ceramic substrate under DPC technology is high, up to 45MPa (greater than the strength of 1mm thick ceramic plate itself).  4. The thickness of conductive layer can be customized within 35μm ~ 1mm.