LED packaging is made by connecting the crystal (Die) with the wire, eutectic or coating packaging technology and the heat dissipation support Submount(sub-adhesive technology), and then connecting...

The full name of VCSEL laser is vertical resonant cavity surface emitting laser, referred to as surface emitting laser. It is a kind of semiconductor laser based on gallium arsenide semiconductor ...

DPC ceramic substrate with its excellent performance and gradually reduced price in many electronics Packaging materials show strong competitiveness in high-power LED packaging substrates as heat ...

Characteristics of DPC ceramic substrate (1) Mechanical properties It has high enough mechanical strength to be used as a supporting component in addition to carrying components; Good machinab...

In the process of electronic packaging, the substrate mainly plays the role of mechanical support protection and electrical interconnection (insulation). With the development of electronic packagi...

The automobile industry has undergone many changes under pressure from energy and environmental protection. Automobile from mechanization to electrification development, into the era of automobile...

According to the latest global market research report, the global 5G Internet of Things market size will reach 700 million US dollars in 2020, and with the demand for iot devices and the gradual po...

As the carrier of heat and air convection, the thermal conductivity of power LED encapsulated PCB plays a decisive role in the heat dissipation of LED. With its excellent performance and gradually ...